As a long-standing partner of CEA / Léti and Soitec in the development of the Smart Cut technology, CEMES strengthens its collaborative links with Soitec and is now committed to a three-year partnership around two Cifre doctoral theses. The first aims to further reduce the defect density of silicon wafers (FDSOI), the second to preserve or restore the piezoelectric properties of certain materials after implantation.
For more than 30 years, researchers at CEMES have been working on ion implantation, defect formation, the
diffusion and precipitation of implanted impurities, and CEMES thus significantly contributed to the state of the art of the field at the international level.claverie at cemes.fr , cherkashin at cemes.fr